In the latest market layout, NVIDIA (stock code: NVDA) has chosen SK Hynix, Samsung, and Micron (stock code: MU) as its HBM partners.

Micron is expanding its HBM capacity globally, with Hiroshima, Japan, being considered as one of the expansion locations. The company plans to increase its HBM market share to 20-25% in the fiscal year 2024 and maintain the same level in 2025. Additionally, progress on HBM3e is proceeding smoothly, with significant profit and market share expected in the future.

Currently, Micron is considering adopting technologies such as hybrid bonding to develop HBM4, emphasizing its advanced packaging, design capabilities, and integrated processes to ensure rapid market entry of its products.

In terms of graphics memory, GDDR7, based on 1β process, transitions from PAM4 to PAM3, reaching speeds of up to 32 Gb per second, with system bandwidth exceeding 1.5 TB/s, a 60% increase over the previous GDDR6 generation. Additionally, GDDR7's energy efficiency improves by over 50%, with enhanced heat dissipation and extended battery life. The new sleep mode reduces system standby power consumption by up to 70%, suitable for AI, gaming, and high-performance computing workloads, enhancing device reliability and data integrity.

Micron states that there is strong interest from customers in HBM3 and HBM3e, and the company maintains a leading position in technology and market, expecting continued growth in profits and market share in the future.