Strong demand for AGI is driving an oversupply situation for HBM, which has significantly pushed up the price of DRAM products.

Recently, Micron is expanding its U.S. HBM test line and plans to open a production base in Malaysia.

Currently, Micron is considering the development of HBM4 technology using hybrid bonding and other technologies that emphasise its advanced packaging, design capabilities and integrated manufacturing processes, thus ensuring rapid product market entry.