Recently, Huawei has published an important patent in the field of semiconductor packaging.。The patent, entitled "A packaging method and device for semiconductor devices," lays the foundation for Huawei's further development in the field of semiconductor packaging.。This patent mainly relates to a semiconductor device packaging method and device, which uses advanced packaging technology to effectively improve the reliability and performance of semiconductor devices。Specifically, the patent secures and protects the chip during the packaging process while achieving efficient heat conduction and electrical signal transmission。This packaging method not only improves the performance of the chip, but also enhances the stability and durability of the chip。