On the 28th, TSMC recently released a blueprint for product planning to enter the 1nm process at the 2023 IEEE International Electronic Components Conference.。More than 1 trillion transistors are expected to be available in 3D packages by 2030, and the company is developing chips containing 200 billion transistors in monolithic architecture.。In order to achieve this goal, the company reiterated that it is working on the development of 2nm-class N2 and N2P production nodes, 1.4nm-class A14 and 1nm-class A10 manufacturing processes, expected to be completed by 2030。