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TSMC receives US$11.6 billion in US chip subsidies and will produce 2nm chips in the US

On April 8, TSMC and the U.S. Department of Commerce announced the signing of a non-binding preliminary agreement. TSMC will receive up to $6.6 billion in direct funding and up to $5 billion in loans under the U.S. Chip and Science Act. Phoenix is ​​building a third wafer foundry to produce 2nm or more advanced chips by 2023.

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